Services
HT-tech:OSAT turnkey service
HT-tech OSAT Turnkey Service

  • Substrate Design

    Substrate
    Wafer Level

  • Package simulation

    Electrical
    Thermal
    Mechanical
    Mold Flow

  • Substrate packaging

    WWB BGA/LGA
    FCCSP/FCLGA
    FCBGA、SiP
    MEMS

  • Logistics Distribution

  • Wafer test and function test

    Analog
    Dialog
    RF
    Memory
    Program
    SLT