Technology
HT-tech:OSAT turnkey service

Location:Home-Technology-SiP

HT-tech adopts advanced test equipment to provide customers with system reliability test and failure analysis.Six kinds of properties, such as MSL/THT, PCT,HTST, HAST, TCT, Solderability were tested.

Technology Types

● Double Side Molding

● High Density SMD molding

● Selective Molding

● Mold cap 4.0mm power moudule

● lrregular Packaging 

● Ultra-small-size component mount process

● Semiconductor Embedded in substrate



Technical Advantages 

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Application Area

SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor, wearable devices, smart city and smart automotive.

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