HT-tech:OSAT turnkey service


HT-tech adopts advanced test equipment to provide customers with system reliability test and failure analysis.Six kinds of properties, such as MSL/THT, PCT,HTST, HAST, TCT, Solderability were tested.

Technology Types

● Double Side Molding

● High Density SMD molding

● Selective Molding

● Mold cap 4.0mm power moudule

● lrregular Packaging 

● Ultra-small-size component mount process

● Semiconductor Embedded in substrate

Technical Advantages 


Application Area

SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor, wearable devices, smart city and smart automotive.