HT-tech adopts advanced test equipment to provide customers with system reliability test and failure analysis.Six kinds of properties, such as MSL/THT, PCT,HTST, HAST, TCT, Solderability were tested.
● Double Side Molding
● High Density SMD molding
● Selective Molding
● Mold cap 4.0mm power moudule
● lrregular Packaging
● Ultra-small-size component mount process
|● Semiconductor Embedded in substrate|
SiP solutions are highly adopted by end customers for applications including wireless communication, computer storage, power and sensor, wearable devices, smart city and smart automotive.