Technology
HT-tech:OSAT turnkey service

Location:Home-Technology-MEMS

MEMS have small size, light weight, low power, high sensitivity, low price, easy mass production and so on, MEMS include a variety of sensors and various package type, very widely use of these sensors, Along with the development of technology, MEMS is become very closed to human life.


1.jpgMEMES Product Categories:

01 Sound:Silicon microphone
02 Pressure:Altimeter,Barometer,3D touch
03 Inertial:Accelerometer,Gyrometer,6lMU
04 Optical:ALS,Photoelectric sensor,Vcsel,Heart rate sensor
05 RFMEMS:Filter (SAW&BAW)
06 Magnetic:AMR,TMR
07 Biology:Biology sensor
08 Finger print:Optical,Capacitive
09 Thermal:Temperature and humidity sensor, Temperature sensor


Technical Competence

TSV, RDL, WLCSP, Wafer tevwel bonding, Strip level bonding FC+WB stack die, Coating protection Metal lid attach,
Glass attach Compression molding Customize molding Clear molding, Open molding Can supply ceramic, lead frame,
substrate solutions, various assembly proposal fulfill customer requirements.

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Application Area

Smart phone,PAD,wearable,medical,industry, automotive widely

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Representative Products

  • Cap Mount Product
    Cap Mount Product

    Specification:
    Package Size: 4030,3526,3729,3722,2718
    Port Location: Top / Bottom
    Cap Type: Metal / Plastic / Substrate

    Application:
    Silicon Microphone, Pressure Sensor 

  • Customized Mold  Product
    Customized Mold Product

    Specification:
    Package Type: QFN / LGA
    Mold Type: Full Open Mold / Partial Open Mold

    Application:
    THTB, Optical Sensor, Heart rate sensor etc.

  • Over Molding Product
    Over Molding Product

    Specification:
    Package Type:QFN / LGA
    Die Attach Orientation: Horizontal(0° or 180°) / Vertical (90°)

    Application:
    G-sensor, AMR/TMR , Multi-axis Inertial
    sensor,RF Filter

  • Finger Print Sensor
    Finger Print Sensor

    Specification:
    Package Type: QFN / LGA
    Mold clearance : Min. 50 um(Over Molding)
    Wire loop:Max 30um
    Package thickness:Min 0.5mm
    Package Outline: Rectangle /  Circle

    Application:
    Mobile Phone, Credit Card , Door Lock,
    Suitcase, ID Card etc.