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MEMS have small size, light weight, low power, high sensitivity, low price, easy mass production and so on, MEMS include a variety of sensors and various package type, very widely use of these sensors, Along with the development of technology, MEMS is become very closed to human life.

MemoryProduct Categories::FLASH   |   DRAM  |   Embedded

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Application Area

Solid state disk or USB flash disk for mobile phone, car, smart home and other fields.

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Representative Products

  • 3D-VNAND
    3D-VNAND

    Specification:
    Package Size: 12x18mm 132Ball
    Package thickness:1.12mm /1.32mm
    Min Die thickness: 30um
    8 die –stack/16 die –stack
    Substrate thickness:0.13mm

    Application:
    Solid state disk 

  • LPDDR4
    LPDDR4

    Specification:
    Package Size: 10x14.5mm 200Ball
    Package thickness: 0.92mm
    Min Die thickness: 40um
    2 die –stack/4 die –stack
    Substrate thickness:0.18mm 2L/4L

    Application:
    Mobile electronics DRAM

  • eMMC
    eMMC

    Specification:
    Package Size: 11.5x13mm 153 Ball
    Package thickness: 0.92mm
    Min Die thickness: 80um
    2 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC, Smart Watch 

  • eMCP/MCP
    eMCP/MCP

    Specification:
    Package Size: 8x10.5mm 162Ball
    Package thickness: 0.92mm
    Min Die thickness: 80um
    3 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC,IoT, Wearable device