Services
HT-tech:OSAT turnkey service

Package Produc

Memory
  • LGA
    Huatian Technology (Nanjing)
  • TSOP
    Huatian Technology (Tianshui)
  • DFN
    Huatian Technology (Xi'an)
  • Micro SD/NM
    Huatian Technology (Nanjing)
  • FCCSP
    Huatian Technology (Nanjing)
  • FBGA/TFBGA/LFBGA
    Huatian Technology (Nanjing)
Substrate Package
  • FBA/TFBGA/LFBGA
    Huatian Technology (Xi'an) (Nanjing)
  • LGA
    Huatian Technology (Xi'an) (Nanjing)
  • EHS-FBGA
    Huatian Technology (Xi'an) (Nanjing)
FlipChip Package
  • FCSOT
    Huatian Technology (Tianshui)
  • FCDFN/FCQFN
    Huatian Technology (Xi'an) (Kunshan)
  • FCBGA/HFCBGA
    Huatian Technology (Nanjing)
  • FCCSP/FCLGA
    Huatian Technology (Xi'an) (Nanjing)
  • ED-FCCSP/HB-FCCSP
    Huatian Technology (Xi'an) (Nanjing)
SiP
  • PA
    Huatian Technology (Xi'an) (Nanjing)
  • SIP
    Huatian Technology (Xi'an) (Kunshan) (Nanjing)
PA
  • WiFi PA
    Huatian Technology (Nanjing)
  • base stationPA
    Huatian Technology (Nanjing)
  • 2G/3G/4G/5Gmobile phonePA
    Huatian Technology (Nanjing)
  • fingerprint
    Huatian Technology (Nanjing)
  • Copper Pillar Bumping
    Huatian Technology (Kunshan) (Nanjing)
  • Solder Bumping
    Huatian Technology (Kunshan) (Nanjing) (Shanghai)
  • Golden Bumping
MEMS & Sensor
  • Customized Mold/Over Mold
    Huatian Technology (Xi'an) (Nanjing)
  • Wafer Level
    Huatian Technology (Kunshan) (Nanjing)