Technology
HT-tech:OSAT turnkey service

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Flip Chip is an ideal interconnect bonding technology. silicon die is directly attached tothe substrate in a face-down way using solder bumps or Cu pillar instead of wire bonds, provides the shortest electrical path  with high electrical andthermal performance. To meet the growing demand for electrical performance, high I/O and high system reliability products.

FC Product Categories


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FCCSP


36-6834X4-17X17


FCLGA


5-560.7X1.1-10×10


FCBGA/HFCBGA/CFCBGA


256-168113X13-42.5×42.5


Technical Characteristics

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Application Area

AP/CPU/GPU/BB/RFIC chips, Printer, Video monitoring, base station, wireless lan, loT, vehicle electronics, network switch, power management, memory and standard linear, analog etc.

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